Testing and Inspection Capabilities
(Listed in Alphabetical Order)
100% Electrical Test (ET)
100% electrical testing is a quality control process where every individual unit or component produced is thoroughly tested to ensure it meets specified requirements or standards. This means that every single item coming off the production line undergoes testing, as opposed to sampling or random testing where only a subset of units is tested. Tests typically include: Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), and Dielectric Withstanding Voltage (DWV).
Standard: Johanson Electrical Specifications
100% Automated Optical Inspection (AOI)
Automated 100% Visual refers to a quality control process where every individual electronic component undergoes automated visual inspection to detect defects or anomalies. This ensures high reliability and quality in manufacturing, especially for critical applications such as aerospace or medical devices.
Standard: EIA-595
100% Visual per MIL-STD- 883
100% Vis Mil 883 refers to a meticulous visual inspection process conducted on every microelectronic component based on MIL-STD-883 standards. This ensures that each component is thoroughly examined for physical defects or irregularities, crucial for maintaining reliability in military and aerospace applications.
Standard: MIL-STD-883 Method 2009
2000 Hour Life Test / High Temp Operational Life (HTOL)
A 2000 Hour Life Test in electrical engineering involves subjecting electronic components or devices to continuous operation for 2000 hours under specific conditions to evaluate their performance and reliability over an extended period, simulating real-world usage to assess longevity and durability.
Standard: MIL-STD-202 METHOD 108
Burn-In
Burn-In is a testing process used to screen electronic components or devices for defects and ensure their reliability before they are put into use. During Burn In, the components are subjected to operating conditions such as elevated temperature, voltage, and sometimes other stresses such as humidity or vibration. The purpose is to simulate and accelerate the aging process and identify potential failures that could occur during normal operation over time. Components that pass the Burn In process are more likely to perform reliably throughout their intended lifespan in real-world applications. Burn In testing helps to improve product quality and reduce the risk of premature failures in electronic systems.
Standard: MIL-STD-883 1015.9
Capacitance
Capacitance is a fundamental electrical property that describes the ability of a component or system to store electrical energy in the form of an electric charge. It is represented by the symbol "C" and is measured in units called farads (F).
Standard: MIL-STD-202 Method 305
Dielectric Withstand Voltage aka Voltage Proof Test (DWV)
Also known as Voltage Proof Test, dielectric withstand voltage refers to the maximum voltage that a dielectric material or component can withstand without suffering electrical breakdown. It is an important measure of the insulation's strength and ability to handle high voltage without failure. By subjecting the material to a specific test voltage, engineers determine the maximum voltage it can handle before breakdown occurs. This specification is crucial in ensuring the safety and reliability of electrical systems by preventing insulation failure and potential hazards.
Standard: MIL-STD-202 Method 301
Destructive Physical Analysis (DPA)
DPA involves detailed examination and testing of electronic components or materials to identify their physical and chemical properties, often requiring the disassembly or alteration of the component, with the aim of understanding failure mechanisms or ensuring quality and reliability.
Standard: EIA-469
Dielectric Voltage Breakdown
The dielectric breakdown voltage test measured the actual breakdown voltage of the dielectric. This is performed by gradually increasing the voltage across the DUT until the current threshold exceeds the specified requirements. Understanding the minimum breakdown voltage is key to knowing the absolute voltage stress limits of a device. In many military standards, dielectric withstanding voltage and rated voltages are a derivative of the minimum dielectric voltage breakdown value.
Standard: Johanson Electrical Specifications
Dissipation Factor (DF)
The dissipation factor, also known as the loss tangent or tangent delta (tanδ), measures the amount of energy lost as heat in a material or component when subjected to alternating current. It quantifies the ratio of resistive losses to reactive energy in the system. A lower dissipation factor indicates higher efficiency, as less energy is wasted as heat. It is an important consideration in electrical systems to minimize losses and improve overall efficiency.
Standard: MIL-STD-202 Method 306
High Temp Storage Test (MIL-STD-202 Method 108)
High Temp Storage Test (HTST) is a reliability test that assesses the long-term performance of electronic components by subjecting them to elevated temperatures (typically 100°C to 200°C) for extended durations. It helps evaluate how components age and whether they maintain their electrical characteristics over time. This test is crucial for ensuring the reliability of components in applications where high temperatures are common, such as automotive and aerospace systems.
Standard: MIL-STD-202 Method 108
Hot IR Test
Hot IR is the measurement of electrical insulation resistance of a component or system while it is operating under normal or elevated temperature conditions. This test helps assess the effectiveness of insulation materials in preventing leakage currents and ensuring electrical safety and reliability in high-temperature environments.
Standard: MIL-STD-202 Method 302
Humidity Test (Biased Humidity)
Humidity test is conducted to assess the effects of humidity on electronic components, assemblies, or devices. The purpose of this test is to evaluate how well electrical equipment can withstand and operate under high humidity conditions, which can be encountered in various environments.
Standard: MIL-STD-202 Method 103
Inductively Coupled Plasma Mass Spectrometry (ICPMS)
ICP-MS is a method for analyzing trace elements and isotopes in samples. It uses an inductively coupled plasma (ICP) to ionize the sample, followed by mass spectrometry to detect and quantify the ions. This technique is widely used in research, environmental analysis, and quality control to determine the composition of materials with high sensitivity and accuracy.
Standard: Johanson Electrical Specifications
Insulation Resistance (IR)
The insulation resistance is a measure of the ability of the charged capacitor to withstand leakage of DC current. Variations in value of insulation resistance can occur due to:
a) Change in surface resistivity, due to moisture or other adsorbed contaminants.
b) Change in bulk dielectric resistivity, due to intrinsic (material) or extrinsic (chip structure) causes.
Standard: MIL-STD-202 Method 302
Mechanical Shock
Mechanical shock testing is performed to evaluate the ability of electronic products to withstand such impacts without damage or performance degradation. The test involves subjecting the device to controlled mechanical shocks of specified magnitude and duration to simulate real-world conditions.
Standard: MIL-STD-202 Method 213
Moisture Resistance Test
Moisture resistance refers to the ability of electronic components or devices to withstand exposure to moisture or humidity without degrading performance or reliability. Components with good moisture resistance are designed to prevent moisture ingress, which can cause corrosion, short circuits, or other electrical failures. Moisture resistance testing evaluates how well components can withstand moisture exposure under specified conditions, ensuring their suitability for use in humid environments or outdoor applications.
Standard: MIL-STD-202 Method 106
Resistance to Soldering Heat (MIL-STD-202 Method 210). AEC-Q200 Test
Resistance to soldering heat test assesses how well electronic components endure high temperatures during soldering without damage. Passing this test ensures components maintain their functionality and reliability during assembly processes.
Standard: MIL-STD-202 Method 210
Resistance to Solvents (MIL-STD-202 Method 215). AEC-Q200 Test
Resistance to Solvents test assesses how well electronic components or materials endure exposure to solvents without deteriorating. It involves subjecting them to solvents they may encounter, evaluating any changes, and ensuring they maintain functionality and reliability in solvent-rich environments, such as during manufacturing or service.
Standard: MIL-STD-202 Method 215
SEM/EDAX (Energy-Dispersive X-Ray Analysis)
SEM/EDX is a technique used to examine materials at a microscopic level and analyze their elemental composition. SEM produces high-resolution images of the sample's surface using an electron beam, while EDX detects and identifies the elements present based on the characteristic X-rays emitted by the sample. This combined method is valuable for studying material properties and composition in electronic components and devices.
Standard: Johanson Electrical Specifications
Shear Test / Bond Pull Test / Bend Test
A “Shear Test or Bond Pull Test” involves applying a controlled force to assess the strength and reliability of a bond between two materials or components, such as a semiconductor chip and its package or a wire and a substrate. This test measures the force required to break or deform the bond, providing critical information about the quality and durability of the bonding process. It helps ensure that the connections within electronic devices can withstand mechanical stress and environmental conditions encountered during normal operation.
Standard: AEC-Q-200-005
Similarity Data
“Similarity data" refers to information or measurements used to compare the characteristics, behavior, or performance of different electronic components, circuits, or systems that exhibit similar attributes or functions. This data helps in assessing the suitability, reliability, or compatibility of components or systems for specific applications based on their similarities in key parameters or features.
Standard: Johanson Electrical Specifications
Solderability
Solderability in electrical engineering refers to the ability of a material, typically a metal or substrate, to form a reliable and durable bond with solder. Good solderability ensures that components can be effectively and securely soldered onto circuit boards or other surfaces during assembly processes. Factors affecting solderability include surface finish, cleanliness, and the presence of oxides, which can impact the quality and strength of solder joints. Solderability testing evaluates how well materials accept solder, ensuring proper functioning and reliability of electronic connections.
Standard: J-STD-002
Sonoscan (Applications of Scanning Acoustic Microscopy / C-SAM)
Sonoscan plays a pivotal role in ensuring the quality, reliability, and functionality of electronic components across diverse industries, including consumer electronics, automotive systems, and aerospace applications.
This equipment enables non-destructive examination of internal structures to detect defects efficiently. It is particularly effective in identifying critical defects such as delaminations, cracks, voids, and other imperfections that could compromise electronic device performance, reliability, or lifespan. Sonoscan provides detailed imaging and analysis of semiconductor package internals, facilitating robust quality control and failure analysis throughout the manufacturing process.
Standard: Johanson Specifications. Johanson can accommodate various standards based on customer request.
Steam Age
Steam Age Test evaluates capacitors under high humidity and elevated temperatures, simulating steam exposure to assess durability. This test helps ensure components can withstand harsh, steam-rich environments, critical for industrial applications.
Standard: J-STD-002
Temp Coefficient of Capacitance (TCC)
TCC measures how a capacitor's capacitance changes with temperature. It quantifies the rate of capacitance change per degree Celsius (ppm/°C or %/°C). A positive TCC means capacitance increases with temperature, while a negative TCC means it decreases. Minimizing TCC ensures stable performance across temperature variations, critical for precision applications such as analog circuits and oscillators. Manufacturers provide TCC values to guide component selection for temperature-sensitive applications.
Standard: Johanson Specifications. Johanson can accommodate various standards based on customer request
Temp Voltage Characteristic (TVC) or Temp Voltage Coefficient
TVC refers to how changes in temperature and DC bias voltage affect the capacitance of a MLCC. It quantifies the relationship between voltage and temperature variations and changes in electrical properties, such as capacitance, to understand component performance under different voltage and temperature conditions. Each application has different operating environments, so understanding the characteristics of a capacitor under the operating voltage and temperature is critical for designing reliable electronic systems. Many common military standards for capacitors specify a voltage-temperature limits such as BP, BX, BR, and BQ. TVC testing is performed to verify that a capacitor conforms to these specified voltage-temperature limits.
Standard: Johanson Specification. Johanson can accommodate various standards based on customer request.
Thermal Shock 10 Cycles
Thermal Shock 10 Cycles is a reliability test where electronic components undergo rapid temperature changes. The component is subjected to alternating extreme hot and cold temperatures within a specified range over 10 cycles. This test simulates real-world thermal stresses to assess the component's ability to withstand temperature variations. Engineers use the results to identify weaknesses and improve durability and performance. Thermal shock testing is crucial for ensuring reliability in diverse electronic applications.
Standard: JESD22 Method JA-104
Thermal Shock 100 Cycles
Thermal Shock 100 Cycles is a reliability test where electronic components are subjected to repeated rapid temperature changes. The component undergoes cycles of extreme hot and cold temperatures to simulate real-world thermal stresses. Engineers use this testing to assess the component's resilience and durability under challenging temperature conditions, identifying potential weaknesses in design or materials. This ensures that components can withstand temperature fluctuations encountered in various applications without compromising performance or longevity.
Standard: JESD22 Method JA-104
Thermogravimetric Analysis (TGA)
TGA is a method used to study how a material's mass changes with temperature. The sample is heated incrementally while its weight loss or gain is continuously monitored. TGA helps assess material stability, composition, and thermal behavior, providing valuable insights for optimizing electronic component design and performance.
Standard: Johanson Electrical Specifications
Vibration
Vibration testing assesses a device's ability to withstand these motions without performance degradation or failure. Engineers use controlled vibration testing to identify design weaknesses and ensure product reliability under real-world conditions. Testing helps optimize designs and materials to enhance durability and meet industry standards for reliability.
Standard: MIL-STD-202 Method 104